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1979
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UPC started business
producing Aluminum Wire Ultrasonic Bonding printed circuit boards (PCB) for
the electronic watch industry.
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1981
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UPC obtained UL
certification for the manufacturing of PCB.
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1983
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UPC succeeded in
Gold Wire T/S Bonding with polyimide material.
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1988
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UPC began production
of multilayer board.
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1989
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UPC installed a Universal
Bare Board Tester to guarantee no "Open / Short circuit"
problem.
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1994
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UPC obtained ISO 9002
certification to enhance its quality system.
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1997
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UPC installed an Automatic
Optical Inspection (AOI) system for better control of inner layer.
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1999
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UPC installed its
first Flying Probe Test System for quick turnaround service. (We now have a total of 6 systems in our facility)
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2000
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UPC expanded production
by acquiring more shop floor area to a total of 65,000 sq. ft.
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2002
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UPC obtained QS 9000
certification to cope with the requirements of the automotive industry.
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2003
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UPC installed innovative
drilling machines for microvias purpose.
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2005
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UPC was ready for mass
production of Blind microvias and Buried vias.
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2007
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UPC obtained ISO/TS
16949 for the automotive industry.
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| 2008
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UPC installed a new ENIPIG line (Electroless Nickel Immersion Palladium Immersion Gold) to allow for better solderability by RoHS operations and excellent gold wire T/S bonding abilities.
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| 2009
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UPC installed its first Orbotech DP-100SL LDI (Laser Direct Imaging) machine for fine line applications and unmatched registration abilities. |
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| 2011
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UPC installed an Alkaline Etchant Recyle And Copper Recovery System for increased process stability and environmental awareness. |
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